Oxford ICP/RIE Plasma Lab 100
eparate RF generators for Inductively Coupled Plasma and electrode provide separate control over ion energy and ion density, High conductance pumping port provides high gas throughput for fastest etch rates, Electrostatic shield eliminates capacitive coupling, reduces electrical damage to devices, reduces chamber particles, Oxford Instruments' ICP tools include wafer clamping and helium cooling as standard, providing excellent temperature control with the option of a wide temperature range.
Oxford | Site
Edmond J. Safra (Givat-Ram)
Nano Center
Contacts
- Golan Tanami
- golant@savion.huji.ac.il